Computer Parts / Computer Fans & Coolers / HEATGREASE
Thermal CPU Paste Compound for Heatsink
HEATGREASE
Improve the Heat Transfer between a CPU and Heatsink through a Ceramic/Silicone Compound
$6.99 USD
In Stock: United States : 689
This thermal CPU paste can be used to improve the effectiveness of a CPU cooler by thermally bonding the CPU to the heatsink, allowing the heatsink and fan to work at their full capacity to remove the harmful heat away from the CPU.
The StarTech.com Advantage
- Improves the heat transfer between a CPU and heatsink to keep the CPU running cooler
- Effectively fills surface imperfections on CPU to prevent air pockets and help heat transfer
- Ceramic based compound that is electrically non-conductive for safe use around electronics
Features
- Ceramic-based compound containing silicone
- Thermal conductivity of more than 1.066 W/m-K
Applications
- Replace old or dried out thermal paste
- Add thermal compound to a new system build for the CPU
Product Numbers
| ASI Distribution USA | 116754 |
| Synnex US | STA-HEATGREASE |
| UPC Code | 065030783422 |
Product appearance and specifications are subject to change without notice.
Technical Specifications
| Warranty Information | |
|---|---|
| Warranty | 2 Years |
| Packaging Information | |
| Shipping (Package) Weight | 0 lb [0 kg] |
| What's in the Box | |
| Included in Package | 1 - Thermal Compound |
Certifications, Reports and Compatibility
Related Products
HEATGREASE10 10g Silicone Thermal CPU Paste Tube Provide improved heat transfer between CPU and heatsink through a silicon compound
$7.99
Not Available 
SILVGREASE1 1.5g Metal Oxide Thermal CPU Paste Compound Tube for Heatsink Provide optimal heat transfer between CPU and heatsink through a metal oxide compound
$6.99
Downloads
Data Sheet(s)
- HEATGREASE_Datasheet.pdf
English - HEATGREASE_Datasheet-ES.pdf
Español - HEATGREASE_Datasheet-FR.pdf
Français - HEATGREASE_Datasheet-IT.pdf
Italiano - HEATGREASE_Datasheet-NL.pdf
Nederlands
