Computer Parts / Computer Fans & Coolers / HSFPHASECM
Heatsink Thermal Pads - Pack of 5
HSFPHASECM
Improves heat transfer between a CPU/chipset and heatsink with easy-to-use thermal pads
$7.99 USD
In Stock: United States : 581
This 5 pack of Thermal Pads offers a suitable alternative to using heatsink paste/grease. The thermal pads remain solid at room temperature, and soften at heatsink operating temperatures - eliminating the mess of heat grease, while maximizing heat conduction to create a cooler operating environment for your hard working CPU.
The StarTech.com Advantage
- Easy "peel and stick" installation ensures an even application each time
- Mess free
Features
- Low thermal impedance
- Electrically non-conductive
- Solid at room temperature, it softens at heatsink operating temperatures
- Conforms to surface irregularities
Applications
- Replaces traditional heatsink grease
Product Numbers
| Dell Harmony | A1310458 |
| TechData Dis | 42602B |
| ASI Distribution USA | 88369 |
| D and H | HSFPHASECM |
| Ingram Micro USA | G08128 |
| Synnex US | STA-HSFPHASECM |
| UPC Code | 065030809191 |
Product appearance and specifications are subject to change without notice.
Technical Specifications
| Warranty Information | |
|---|---|
| Warranty | 2 Years |
| Performance | |
| Thermal Conductivity | 0.7 W/m-k |
| Thermal Resistance | 0.03 °C-in/W @ 50 PSI |
| Specific Gravity | 1.11 |
| Physical Characteristics | |
| Color | Pink |
| Materials | Phase Change Temperature: 58°C
Volume Resistivity: 1x 1015 Ohm-cm |
| Product Length | 1.2 in [30 mm] |
| Product Width | 1.2 in [30 mm] |
| Product Height | 0 in [0.1 mm] |
| Environmental | |
| Operating Temperature | -60°C to 125°C (-76°F to 257°F) |
| Special Notes / Requirements | |
| Note | Heatsink/Component Clamping Pressure (Recommended): 5 to 100 PSI (0.035 to 0.690 MPa) |
| Packaging Information | |
| Package Quantity | 5 |
| Shipping (Package) Weight | 0 lb [0 kg] |
| What's in the Box | |
| Included in Package | 5 - Thermal Pad |
Certifications, Reports and Compatibility
Related Products
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Not Available 
SILVGREASE1 1.5g Metal Oxide Thermal CPU Paste Compound Tube for Heatsink Provide optimal heat transfer between CPU and heatsink through a metal oxide compound
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Downloads
Manual(s):
- HSFPHASECM.pdf
English
Data Sheet(s)
- HSFPHASECM_Datasheet.pdf
English - HSFPHASECM_Datasheet-ES.pdf
Español - HSFPHASECM_Datasheet-FR.pdf
Français - HSFPHASECM_Datasheet-IT.pdf
Italiano - HSFPHASECM_Datasheet-NL.pdf
Nederlands
